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401 Absolute Maximum Ratings (TA=25℃)
Parameter
Symbol
Rating
Unit
Power Dissipation
PD
200
mW
Forward Current (DC)
IF
60
mA
Peak Forward Current﹡
IFP
100
mA
Reverse Voltage
VR
5.0
V
Operation Temperature Range
Top
-25to+80
℃
Storage Temperature Range
Tstg
-40to+100
℃
Soldering Temperature
260℃/5sec
﹡Pulse width≤0.1msecDuty Ratio ≤1/10
4 Electrical and Optical Characteristics (TA=25℃)
Parameter
Test Condition
Symbol
Min
Typ
Max
Unit
Forward Voltage(VF)
IF=60mA
VF
V
2.8
3.2
View Angle
IF=60mA
2θ1/2
120
deg
Reverse Current
VR=-5V
IR
10
μA
Color Temperature
IF=60mA
CCT
2580
7040
K
Luninous Intendity(IV)
IF=60mA
IV
27
29
LM
Notes:
RA>80.
(Tolerance: IV±10%,VF±0.05V,x,y±0.005)
IFPConditions:Pulse width≤10msec,and Duty≤1/10
8.1 Storage存储
- a. Don’t open the moisture proof bag before ready to use the LEDs.在未准备使用LED 之前不要打开防潮袋
- b. The LEDs should be kept at30℃or less and 65%RH or less before opening the package. The max.period before opening the package is 1 year.未开密封袋之前LED 建议的存储环境为温度小于30℃、湿度
<65% RH,且 的存储期为1年。
- c. After opening the package, the LEDs should be kept at 30℃/60%RHor less, and it should be used within 3 days. If the LEDs should be kept at 30-60%RH or more, and it should be used within 12hours.打开密封袋后,环境温湿度保持在30℃/60%RH 或 低,需在3 天内使用。如果环境温湿度超过30℃/60%RH, 则必须12 小时内使用。
- d. If the LEDs be kept over the conditions of 30%, baking is required before mounting. Baking condition as below: 70±5℃for 4 hours for roll goods, 105±5℃for 1 hours for bulk goods.如果湿度指示卡显示湿度为30%,在使用之前需要烘烤除潮。烘烤条件如下:卷装70±5℃为4 时,散装105±5℃1小时。
- e. The environment have no acid、alkali、corrosive gas、intensively shake and high magnetic field.
存储环境需隔绝酸、碱、腐蚀性气体,强烈震动和高磁场。
Cautions注意事项
The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the of package. The pressure to the surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle, the pressure on the silicone resin should be proper. LED封装胶为硅胶,表面较软,用力按压胶体表面会影响LED可靠性,因此应有预防措施避免在按压器件,当使用吸嘴时,胶体表面的压力应是恰当的。
Handling Precautions 处理防备措施
- a. LED operating environment and sulfur element composition cannot be over 100PPM in the LED mating usage material. This is provided for informational purposes only and is not a warranty or endorsement.LED 工作环境及与LED 适配的材料中硫元素及化合物成份不可超过100PPM.这只是一个建议,不作任何品质担保。
- b. In order to prevent external material from getting into the inside of LED, which may cause the malfunction of LED, the single content of Bromine element is required to be less than 900PPM, the single content of Chlorine element is required to be less than 900PPM, the total content of Bromine element and Chlorine element in the external materials of the application products is required to be less than 1500PPM. This is provided for informational purposes only and is not a warranty or
endorsement.为了防止外界物质进入LED内部以造成LED的损伤,所处环境及所用套件等等,单一的 元素含量要求小于900PPM,单一氯元素含量要求小于900PPM, 元素与氯元素总含量必须小于1500PPM.这只是一个建议,不作任何品质担保。
- c. advises against the use of any chemicals or materials that have been found or are suspected to have an adverse affect on device performance orreliability.Toverify compatibility, JF recommends that all chemicals and materials be tested in the specific application and environment for which they are intended to be used.反对使用任何对LED 器件的性能或者可靠性有害的物质或材料,不管这些材料是已经证实了的还是仅仅怀疑有害。针对特定的用途和使用环境,建议对所有的物质和材料进行相容性的测试。
- d. Handle the component along the side surface by using forceps or appropriate tools; do not directlytouch or Handle the silicone lens surface,it may damage the internal circuitry.通过使用适当的工具从材料侧面夹取,不可直接用手或尖锐金属压胶体表面,它可能会损坏内部电路。
- e. In designing a circuit, the current through each LED must be exceed the absolu ximum rating specified for each LED. In the meanwhile, resistors for protection should be applied, otherwise slight voltage shift will cause big current change,burn out may happen.设计电路时,通过LED 的电流不能超过规定的最大值,同时,还需使用保护电阻,否则,微小的电压变化将会引起较大电流变化,可能导致产品损毁。
Thermal Design is paramount importance because heat generation may result in the Characteristics decline, such as brightness decreased, Color change and so on. Please consider the heat generation of the LEDs when making the system design.LED容易因为自身的发热和环境的温度改变而改变,温度升高会降低LED发光效率,影响发光颜色,所以在设计时应充分考虑散热问题。





