Notes:（备注）

1. 1. All dimension units are millimeters.（所有标注尺寸单位为毫米）
2. 2. All dimension tolerance is ±0.15mm unless otherwise noted.（除特别标注外，所有尺寸允许公差±0.15mm ）

3. Cautions注意事项

   The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the of package. The pressure to the surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle, the pressure on the silicone resin should be proper.

   LED封装为硅胶，故LED胶体表面较软，用力按压胶体表面会影响LED可靠性，因此应有预防措施避免在封装的零件上的强大压力，当使用吸嘴时，胶体表面的压力应是恰当的。

    

    

    

   Handling Precautions处理防备措施

   Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more prone to damage by external mechani- cal force . As a result, Special handling precautions must be observed during assembling using sili- cone encapsulated LED products, Failure to comply might leads to damage and premature failure of the LED.

   相对环氧树脂较脆较硬而言，硅胶封装较柔软且有弹性，虽然它的特性大大减少了热应力，但易受机械外力损坏，因此在手工处理方面须要对硅胶封装材料做预防措施，若未按要求操作，可能会导致LED损坏和光衰

    

   1. Handle the component along the side surface by using forceps or appropriate tools; do not directly touch or Handle the silicone lens surface, it may damage the internal circuitry.

   通过使用适当的工具从材料侧面夹取，不可直接用手或尖锐金属压胶体表面，它可能会损坏内部电路

    

    

    

    

    

    

    

    

    

    

    

    

   2. The outer diameter of the SMD pickupnozzleshould not exceed the size of theLEDto prevent air leaks. The inner diameter of the nozzle should be

   as large as possible. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production.

   为防止气压泄漏，SMD吸咀外径不可以超过LED尺寸，吸咀内径尺寸应尽可能大，吸咀顶端材质建议采用柔软材料以防在吸取期间刮伤或损坏LED胶体表面，元件的尺寸必须在取放机里准确的编程好，以确保 的吸取和避免生产过程中的损害

    

    

    

   3. Do not stack together assembled containing LEDs. Impact may scratch the silicone lens or damage the internal circuitry

   不可将模组材料堆积在一起，它可能会损坏内部电路

   4. Not suitable to operate in acidic envi- ronment, PH<7

   不可用在PH<7的酸性场所

    

    

    

    

    

    

    

    

    

   5. LED operating environment and sulfur element composition cannot be over 100PPM in the LED mating usage material.

   LED工作环境及与LED适配的材料中硫元素及化合物成份不可超过100PPM

    

    

    

    

   6. When we need to use external glue for LED application products, please make sure that the exter- nal glue matches the LED packaging glue. Additionally ,as most ofLEDpackaging glue is silica gel, and it has strong Oxygen permeability as well as strong moisture permeability; in order to prevent ex- ternal material from getting into the inside of LED, which may cause the malfunction of LED, the single content of Bromine element is required to be less than 900PPM,the single content of CYTorine element is required to be less than 900PPM,the total content of Bromine element and CYTorine element in the external glue of the application products is required to be less than 1500PPM

   当我们需要使用外封胶涂抹LED产品时，应确保外封胶与LED封装胶水相匹配，因为大多数LED的封装胶水为硅胶，它有较强的氧化性和较强的吸湿性，必须防止外封材质进入LED内部以造成LED的损伤，单一的 元素含量要求小于900PPM，单一氯元素含量要求小于900PPM，在涂抹LED产品时要求外封胶 元素与氯元素总含量必须小于1500PPM

    

    

    

    

    

    

    

    

    

    

    

    

    

    

    

    

    

    

    

    

    

   7. Other points for attention, please refer to our LED user manual.

   其它注意事项请参照我们的LED使用手册

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